Document Type
Article
Publication Date
2015
Publication Source
Journal of Applied Physics
Abstract
The characterization of Cu/diamond interface thermal conductance (hc) along with an improved understanding of factors affecting it are becoming increasingly important, as Cu-diamond composites are being considered for electronic packaging applications. In this study, ∼90 nm thick Cu layers weredeposited on synthetic and natural single crystal diamond substrates. In several specimens, a Ti-interface layer of thickness ≤3.5 nm was sputtered between the diamond substrate and the Cu top layer. The hc across Cu/diamond interfaces for specimens with and without a Ti-interface layer was determined usingtime-domain thermoreflectance. The hc is ∼2× higher for similar interfacial layers on synthetic versus natural diamond substrate. The nitrogen concentration of synthetic diamond substrate is four orders of magnitude lower than natural diamond. The difference in nitrogen concentration can lead to variations in disorder state, with a higher nitrogen content resulting in a higher level of disorder. This difference in disorder state potentially can explain the variations in hc.
Furthermore, hc was observed to increase with an increase of Ti-interface layer thickness. This was attributed to an increased adhesion of Cu top layer with increasing Ti-interface layer thickness, as observed qualitatively in the current study.
Inclusive pages
074305-1 to 074305-8
ISBN/ISSN
0021-8979
Document Version
Published Version
Copyright
Copyright © 2015, AIP Publishing. This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing.
Publisher
AIP Publishing
Volume
117
Peer Reviewed
yes
eCommons Citation
Sinha, Vikas; Gengler, Jaime J.; Muratore, Christopher; and Spowart, Jonathan E., "Effects of Disorder State and Interfacial Layer on Thermal Transport in Copper/Diamond System" (2015). Chemical and Materials Engineering Faculty Publications. 97.
https://ecommons.udayton.edu/cme_fac_pub/97
Included in
Other Chemical Engineering Commons, Other Materials Science and Engineering Commons, Polymer and Organic Materials Commons
Comments
This document is provided for download in compliance with the publisher's policy on self-archiving. Permission documentation is on file.