Design, Fabrication, and Characterization of Photonic Devices
A 16 X 16 Crossover photonic switching network with hybrid integrated CMOS/SEED smart pixel device and 2D optical fiber bundle array I/O access device is reported in this paper. SEEd array devices ar used as light receivers and transmitters, while CMOS devices make efficient logical processing. 4 X 40 2D multilayer optical fiber bundle arrays are fabricated and are used as I/O access devices in the crossover photonic switching network. The center to center spacing between adjacent optical fibers in the same layer of the fiber array is 125micrometers , and the spacing between adjacent layers is 250micrometers . Displacing tolerance of the fiber bundle arrays is less than 4 micrometers and the angular tilt error is less than 0.03 degree. It has the feature of high density, high precision, array permutation and easy to couple with 2D CMOS/SEED smart pixel device.
Copyright © 1999, International Society for Optical Engineering
International Society for Optical Engineering
Place of Publication
Luo, Fengguang; Cao, Mingcui; Hu, Qiaoyan; Wan, Anjun; Xu, Jun; Deng, Cong; and Liu, Deming, "Crossover Photonic Switching Network with CMOS/SEED Smart Pixel Device and 2D Optical Fiber Bundle Array" (1999). Electro-Optics and Photonics Faculty Publications. 65.