Part of the Engineering Commons
Channel Height and Curvature Effects on Flow Boiling from an Electronic Chip, John E. Leland, Louis C. Chow John Leland
Immersion Cooling of a Simulated Electronic Chip Protruding into a Flow Channel, John E. Leland, Louis C. Chow John Leland
The Drag Coefficient of a Sphere in a Square Channel, Louis C. Chow, John E. Leland, J. E. Beam, E. T. Mahefkey John Leland
Forced Convection Boiling from a Nonflush Simulated Electronic Chip, John E. Leland, Louis C. Chow John Leland
High Heat Flux Cooling for Spacecraft Electronics, Louis C. Chow, John E. Leland John Leland
Immersion Cooling of a Simulated Electronic Chip Protruding into a Flow Channel, John E. Leland, Louis C. Chow Office for Research Publications and Presentations
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Channel Height and Curvature Effects on Flow Boiling from an Electronic Chip, John E. Leland, Louis C. Chow Office for Research Publications and Presentations
Forced Convection Boiling from a Nonflush Simulated Electronic Chip, John E. Leland, Louis C. Chow Office for Research Publications and Presentations
High Heat Flux Cooling for Spacecraft Electronics, Louis C. Chow, John E. Leland Office for Research Publications and Presentations
PDF
The Drag Coefficient of a Sphere in a Square Channel, Louis C. Chow, John E. Leland, J. E. Beam, E. T. Mahefkey Office for Research Publications and Presentations
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