Low temperature co-fired ceramic (LTCC) substrate for high temperature microelectronics

Date of Award

2017

Degree Name

M.S. in Electrical Engineering

Department

Department of Electrical and Computer Engineering

Advisor/Chair

Advisor: Vamsy Chodavarapu

Abstract

Advances in aerospace technologies demand new ways to package electronics for high temperature and harsh environments. One packaging method of interest in academia and industry is Low Temperature Co-fired Ceramic (LTCC). LTCC is a multi-layer design and packaging system that can embed passive components and thermal management structures within a substrate. This thesis compiles research done to evaluate LTCC as a high-performance electronic packaging technique by determining the performance of embedded passives and thermal management structures at temperatures from -55°C to 225°C. The passive structures and thermal management structures are evaluated using theoretical calculations, simulations, and measurements of fabricated devices.

Keywords

Low Temperature Cofired Ceramic technology Evaluation, Electronics Protection, Shielding (Heat), Electrical Engineering, LTCC, Electronic Packaging, Low Temperature Co-Fired Ceramic, High Temperature Electronics, Microelectronics

Rights Statement

Copyright © 2017, author

Link to Full Text

Share

COinS