Thermal Management and Packaging Techniques for High Performance Electrical Systems
Date of Award
Ph.D. in Engineering
Department of Electrical and Computer Engineering
Advisor: Vamsy Chodavarapu
Many modern applications - such as aerospace or automotive - demand electronic systems that can operate for extended periods of time at elevated temperatures. Common mitigation techniques for electronic systems operating at high temperatures include thermal passivation or the use of specialized circuits. While these solutions are able to meet many of the requirements of high temperature system design, they are often either intended for short-term applications or are costly when compared to their Commercial-o?-the-Shelf (COTS) equivalents. An alternate solution is to couple thermal management and electronic packaging techniques into a novel cooling architecture to increase the operating temperature of COTS electronic systems. This dissertation investigates the use of Mass Via Array (MVA) and micro Thermo-electric Coolers (TEC) as a low Size, Weight, Power, and Cost (SWAP-C) solution to this problem. Using a systems engineering approach, MVA and TEC devices are investigated individually and as an integrated cooling architecture for a system operating at ambient temperatures between 25 C and 100 C. A variety of modeling simulation techniques in conjunction with measurements of fabricated devices are used to evaluate the performance of this novel cooling architecture.
Electrical Engineering, Electronic Packaging, Thermal Management, Mass Via Array, Thermoelectric Coolers
Copyright 2020, author
Smarra, Devin, "Thermal Management and Packaging Techniques for High Performance Electrical Systems" (2020). Graduate Theses and Dissertations. 6924.