David J Lombardo
Download Project (533 KB)
The details of how photo resist is exposed during lithography processes are extremely important to optimizing fabrication. Features such as sloped sidewalls, undercut, scalloping can be caused by the diffraction, absorption and reflection of light as it passed through the layers of mask, resist and substrate. A current method of simulating this process is with a full Finite Difference Time Domain process, which is computationally intensive and time consuming. In this project I propose and demonstrate a forward/backward spatial propagation simulation without time steps, which will capture the full electromagnetic solution including diffraction and reflections. By combining this with physical Dill Parameters of the resist a complete picture of the exposing process can be efficiently created.
Course Project - Graduate
Andrew M. Sarangan, Ivan Sudakov
Primary Advisor's Department
Stander Symposium poster
"Computational Lithography for Electromagnetic Wave Propogation in Photoresist" (2017). Stander Symposium Projects. 1073.