Title
Mechanical Strain Dependence of Thermal Transport in Amorphous Silicon Thin Films
Document Type
Article
Publication Date
2015
Publication Source
Nanoscale and Microscale Thermophysical Engineering
Abstract
Recent computational studies predict mechanical strain–induced changes in thermal transport, which is yet to be validated by experimental data. In this article, we present experimental evidence of an increase in thermal conductivity of nominally 200-nm-thick freestanding amorphous silicon thin films under externally applied tensile loading. Using a combination of nanomechanical testing and infrared microscopy, we show that 2.5% tensile strain can increase thermal conductivity from 1 to 2.4 W/m-K. We propose that such an increase in thermal conductivity might be due to strain-induced changes in microstructure and/or carrier density. Microstructural and optical reflectivity characterization through Raman and infrared spectroscopy are presented to investigate this hypothesis.
Inclusive pages
1-16
ISBN/ISSN
1556-7265
Copyright
Copyright © 2015, Taylor & Francis Group, LLC, a division of Informa plc. This material is strictly for personal use. For any other use, the user must contact Taylor & Francis directly at this address: permissions.mailbox@taylorandfrancis.com. Printing, photocopying and sharing via any means is a violation of copyright.
Publisher
Taylor & Francis
Volume
19
Peer Reviewed
yes
Issue
1
eCommons Citation
Alam, Tarekul; Pulavarthy, Raghu; Muratore, Christopher; and Haque, M. Amanul, "Mechanical Strain Dependence of Thermal Transport in Amorphous Silicon Thin Films" (2015). Chemical and Materials Engineering Faculty Publications. 121.
https://ecommons.udayton.edu/cme_fac_pub/121
COinS
Comments
Permission documentation is on file.