Document Type
Article
Publication Date
2000
Publication Source
Journal of Applied Physics
Abstract
A method of producing a polycrystalline silicon thin film on a foreign substrate without subsequent annealing has been developed. Thermally evaporated 5–100 nm thick Nifilms served as prelayers for magnetron sputtered Si thin films. A continuous film was obtained as a result of metal induced growth of polysilicon during low temperature (below 600 °C) deposition. The film uniformity is promising for large area device applications. The influence of the Ni prelayer thickness on the grain size of thus obtained films was investigated. Atomic force microscopy and cross-sectional scanning electron microscopy studies revealed features in the 150–600 nm size range while x-ray diffraction and Raman spectra analysis predicted 50–100 nm diam randomly oriented grains and a complete absence of an amorphous phase. The carrier lifetime was evaluated to be 11 μs.
Inclusive pages
3532-3536
ISBN/ISSN
0021-8979
Document Version
Published Version
Copyright
Copyright © 2000, American Institute of Physics
Publisher
American Institute of Physics
Volume
87
Peer Reviewed
yes
Issue
7
eCommons Citation
Guliants, Elena A. and Anderson, Wayne A., "Characterization of Poly-Si Thin Films Deposited by Magnetron Sputtering onto Ni Prelayers" (2000). Electrical and Computer Engineering Faculty Publications. 115.
https://ecommons.udayton.edu/ece_fac_pub/115
Included in
Computer Engineering Commons, Electrical and Electronics Commons, Electromagnetics and Photonics Commons, Optics Commons, Other Electrical and Computer Engineering Commons, Systems and Communications Commons
Comments
This document is provided for download in compliance with the publisher's policy on self-archiving. Permission documentation is on file.