A Novel Method of Structure Control in Si Thin Film Technology
Document Type
Article
Publication Date
2001
Publication Source
Journal of The Electrochemical Society
Abstract
A technological method of thin film silicon growth with an unconventional structure control has been uncovered. It involves a concurrence of metal-induced crystallization with direct growth of crystalline silicon at temperatures of ca. 575°C. Thermally evaporated 5-100 nm thick Ni films were used as prelayers for magnetron sputtered Si films. The thickness of a Ni prelayer was established to significantly alter the silicon film growth, providing a large-grain columnar structure when occurring in the 25-30 nm range, and diminishing the Si grain size toward corresponding lower and higher values of the Ni thickness. The phenomenon is attributed to the silicide nucleation processes at the Ni-Si interface. A decrease in the kinetic energy of the arriving Si atoms accomplished by lowering the magnetron power led to the formation of self-organized nanostructures on the Si film surface suggesting the Stranski-Krastanov growth mode which is also induced by the Ni silicide prelayer. Theoretical aspects of Si film growth are briefly discussed.
Inclusive pages
G156-G158
ISBN/ISSN
0013-4651
Copyright
Copyright © 2001, The Electrochemical Society
Publisher
The Electrochemical Society
Volume
148
Peer Reviewed
yes
Issue
3
eCommons Citation
Guliants, Elena A. and Anderson, Wayne A., "A Novel Method of Structure Control in Si Thin Film Technology" (2001). Electrical and Computer Engineering Faculty Publications. 121.
https://ecommons.udayton.edu/ece_fac_pub/121
Comments
Permission documentation is on file.