Dynamic Thermal 3D Point Cloud Generation Using Structure from Motion

Date of Award

5-5-2024

Degree Name

M.S. in Electrical Engineering

Department

Department of Electrical and Computer Engineering

Advisor/Chair

Hui Wang

Abstract

Dynamic Thermal Point Cloud (DTPC) technology represents a cutting-edge approach in the field of remote sensing, offering unprecedented capabilities for monitoring volumetric changes in objects, analyzing structural integrity in existing constructions, and conducting comprehensive thermal audits. This innovative methodology integrates high-resolution thermal imaging with advanced point cloud data analytics, allowing for the precise capture and analysis of thermal properties across various surfaces and structures in real time. DTPC leverages the synergy between thermal imaging technology and 3D scanning to generate detailed, multi-dimensional representations of objects and environments. These representations are not only accurate but also thermal information, enabling the detection of temperature variations with high precision. DTPC offers a robust tool for assessing the structural integrity and thermal efficiency of buildings and infrastructure. By providing a detailed view of thermal anomalies, such as heat leaks or insulation failures, it facilitates targeted interventions that enhance energy efficiency. Furthermore, DTPC stands out by offering a comprehensive and non-invasive means of evaluating the thermal performance of facilities and systems. Through its detailed thermal and spatial analysis, it identifies areas of energy loss, inefficient HVAC performance, and other factors contributing to increased energy consumption. This information is invaluable for implementing corrective measures that optimize energy usage, reduce operational costs, and contribute to environmental sustainability.

Keywords

3D, SfM

Rights Statement

Copyright 2024, author

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