Title

University to join Midwest network to address national semiconductor needs

Authors

University of Dayton

Document Type

News Article

Publication Date

8-4-2022

Abstract

With Intel building two chip factories in Ohio, the University of Dayton is joining leading Midwest research institutions in a network to support the semiconductor and microelectronics industry's research, supply chain and workforce needs.

Recommended Citation

University of Dayton, "University to join Midwest network to address national semiconductor needs" (2022). News Releases. 11693.
https://ecommons.udayton.edu/news_rls/11693