Experimental Investigation of an Air Microjet Array Impingement Cooling Device

Author(s)

John E. Leland, University of DaytonFollow
Rengasamy Ponnappan, UES Inc.
Kevin S. Klasing, UES Inc.

Document Type

Article

Publication Date

2002

Publication Source

Journal of Thermophysics and Heat Transfer

Abstract

A microjet impingement cooling device for high power electronics was constructed from silicon wafers using microelectromechnical systems fabrication techniques. The array of 221, 0.277-mm-diam jets was tested using air as the coolant for jet diameter Reynolds numbers from 4.65 x 10(2) to 1.405 x 10(3). Heat transfer and pressure drop data were obtained for a range of mass rates extending up to the point of choked How and also for variable heat fluxes. The results were compared to an existing Nusselt correlation for jet impingement arrays that was found to significantly under-predict the heat transfer. A new correlation is provided that also accounts for variable air properties.

Inclusive pages

187-192

ISBN/ISSN

0887-8722

Comments

Permission documentation is on file.

Copyright

Copyright © 2002, American Institute of Aeronautics and Astronautics

Publisher

American Institute of Aeronautics and Astronautics

Volume

16

Issue

2

Peer Reviewed

yes

eCommons Citation

Leland, John E.; Ponnappan, Rengasamy; and Klasing, Kevin S., "Experimental Investigation of an Air Microjet Array Impingement Cooling Device" (2002). Office for Research Publications and Presentations. 47.
https://ecommons.udayton.edu/ofr_pub/47